它是一種在矽晶片上進行化學鍍的設備。 在旋轉的同時上下擺動一塊或多塊晶圓。
您可以分別調整旋轉速度和上下擺動速度。
Ёэヵ⑦ヨラг上ズ無電解バゲわメ行よ?置ザエ。1枚∼複?枚ソヨラгメ回?イオスゎヘ上下ズ?動イオサバゲわウネエ。
回?速度シ上下?動速度ゾガホキホ調節ザわネエ。
＊受注生?品
＊詳細ゾれ問ゆ合マオ下イゆ
For conducting electroless plating on silicon wafers. Plating is possible from a single wafer to multiple wafers by vibrating the wafer(s) in vertical direction, while rotating them at the same time.
The rotating speed and the vertical vibration speed can be adjusted.
